Adhesive based materials are manufactured using a layer of adhesive between the copper and polyimide film to create a mechanical bond. Tech-Etch carries inventory of two main adhesive types, acrylic and epoxy. Other adhesive systems are also available. Please consult the factory.
Rigid laminate materials are used in conjunction with the flex materials discussed above to crease rigid-flex products. These laminates are typically FR-4 bonded with epoxy pre-preg. Tech-Etch has the ability to work with material from many suppliers conforming to several IPC standards. Contact the factory to review your specific design requirements.
Alternate Circuit Layer Materials
Exotic and Thick Metal – Tech-Etch’s photo-etching experience gives us the ability to manufacture flex using a variety of conductor materials, including copper alloys, nickel, kovar, stainless steel, and resistance alloys. Consult with engineering if you have specific requirements.
Stainless Steel Circuit
Polyimide film bonded over the conductor layer with acrylic or epoxy adhesive are the traditional choices for cover layer material. Polyimide thickness ranges from .0005" to .005" are typically available in .001" increments. Adhesive thickness is a function of circuit construction and is usually left to the discretion of the manufacturer.